ASM Standard substrate carrier | ASMPT SMT Solutions - Process Support Products
ASMPT SMT Solutions |

Standard substrate carrier

Maximum support for flexible, odd-shaped or delicate substrates

Electronics miniaturization driven by mobile electronics, wearables, high-density connectors and LED strips require printing onto flexible PCBs, small boards and odd-shaped substrates. These applications need fixed pallets for robust transport through the SMT process.

  • Consistent flatness, stable printing, process control
  • Pallet size: 400 mm x 400 mm
  • Wafer diameters: 4/5/6/8/12 inches (100 mm to 300 mm)
  • Wafer thickness: 150 µm to 600 µm
  • The wafer is vacuum-secured during transport; automatic and manual operation
  • Custom solutions available
  • Data formats: Gerber, DXF, DWG
  • Material: Durastone, aluminum and sintered stainless steel

For more info click on the links below.