Stencil coating technologies | ASMPT SMT Solutions - Process Support Products
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Stencil coating technologies

Reduce cleaning frequency, improve paste release now with a much longer lifetime

DEK Stencil coatings are extremely thin fluxophobic coatings that can be applied to the stencil surface and/or aperture interior walls. Solder paste is prevented from adhering to the coated areas, helping reduce required understencil cleaning frequency and, in the case of coated apertures, encourage better material transfer efficiency.

DEK NanoUltra Gold stencil coating – Applied immediately following stencil production, DEK NanoUltra Gold covers the underside of the stencil and the aperture walls with a hydrophobic and oleophobic permanent coating. The coating provides improved print definition for challenging Area Ratios, better transfer efficiency and reduced understencil cleaning frequencies.


  • Improved performance and transfer efficiency
  • Significantly reduces the need for underside cleaning, thus minimizing  costs and improving throughput
  • Optimize print quality
  • Visible and controllable coating solution
  • Very long lifetime

NanoClear® stencil coating – A self-applied nano stencil coating technology that comes conveniently packaged in a single-use, cost-effective wipe, NanoClear® helps reduce cleaning frequency and eliminate common defects such as bridging, insufficient material and solder balling.

Get more information down below.