DEK Ultra-fine pitch (UFP) ECO understencil cleaning rolls

Boost productivity and yield; reduce defects and cost

DEK UFP ECO roll fabric is designed with unique, 3D pockets that trap and hold solder paste particles to ensure a quick and effective clean. The fiber enables fast wicking, as solvent is instantaneously delivered to the stencil for excellent cleaning and reduced solvent consumption.

• Outstanding cleaning performance
• Solvent consumption reduced by an average of 50%
• Faster, more effective cleaning
• Higher throughput
• Keeps solder particles away from the stencil to reduce smear

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