DEK Ultra-fine pitch ECO rolls | ASMPT SMT Solutions - Process Support Products
ASMPT SMT Solutions |

DEK Ultra-fine pitch (UFP) ECO understencil cleaning rolls

Boost productivity and yield; reduce defects and cost

DEK UFP ECO roll fabric is designed with unique, 3D pockets that trap and hold solder paste particles to ensure a quick and effective clean. The fiber enables fast wicking, as solvent is instantaneously delivered to the stencil for excellent cleaning and reduced solvent consumption.

  • Outstanding cleaning performance
  • Solvent consumption reduced by an average of 50%
  • Faster, more effective cleaning
  • Higher throughput
  • Keeps solder particles away from the stencil to reduce smear

Get more information down below.