DEK Ultra-fine pitch (UFP) ECO understencil cleaning rolls
Boost productivity and yield; reduce defects and cost
DEK UFP ECO roll fabric is designed with unique, 3D pockets that trap and hold solder paste particles to ensure a quick and effective clean. The fiber enables fast wicking, as solvent is instantaneously delivered to the stencil for excellent cleaning and reduced solvent consumption.
- Outstanding cleaning performance
- Solvent consumption reduced by an average of 50%
- Faster, more effective cleaning
- Higher throughput
- Keeps solder particles away from the stencil to reduce smear
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